BS IEC 63068-3:2020 pdf free.Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Test method for defects using photoluminescence.
BS IEC 63068-3 Defects with characteristic PL features shall be evaluated by PL method. The following descriptions concern such defects in n/n+-type 4H-SiC homoepitaxial wafers with an off-cut angle of 4° along the direction of [11 20], where their PL images are obtained by detecting emission wavelengths longer than 650 nm:一individual linear defects exhibiting bright line images, e.g. BPDs; – individual planar defects exhibiting dark contrast images, e.g. stacking faults, propagated stacking faults, stacking fault complexes, and polytype inclusions.
When emission wavelengths from 400 nm to 500 nm are used for the defect detection,stacking faults exhibit bright contrast images.Defects without characteristic PL features or with weak PL contrasts against SiC area with no defects should be evaluated by other test methods such as optical inspection and X-ray topography. Those defects include micropipes, TSDs， TEDs， scratch traces, particle inclusions, bunched-step segments, and surface particles.PL images of defects are captured and transformed into a digital format. In the course of this process, an SiC homoepitaxial wafer is irradiated with excitation light whose energy is greater than the bandgap of 4H-SiC crystals, and the resulting PL is collected and recorded as a PL image of a specified area of the wafer including defects. PL is detected using an optical image sensor such as a CCD image sensor, and PL image is usually acquired using an optical filter which transmits a specific range of PL appropriate for the detection of each type of defect.Then, the obtained PL image (digital image) is processed by manipulating the grey levels of the image. Through a specified scheme of image analysis, the image information is reduced to a set of values which are specific to the detected defects .A greyscale image is produced from the original digital image of defects in the wafer. This image can be converted into a binary image (thresholding). The size and shape of defects are measured, and the distribution and number of defects within a specified area of wafer are calculated.NOTE The size of planar and volume defects extending along the off-cut direction depends on the thickness of homoepitaxial layer. Details of such defects and the method of estimating the size of their PL images are described in Annex A and 4.6.2, respectively.BS IEC 63068-3 pdf download.